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SMT red glue is certain type of temperature-set adhesive that is used during the SMT process to fix certain components to the board in circumstances where they might lose connection or fall off before solder reflow takes place.
The SMT Red Glue RSC 2201 is a new adhesive for SMT applications. Electronic assembly needs strong, heat-resistant glues for secure bonding. RSC 2201 is great for automated SMT production because it has good viscosity and dispensing abilities. This red glue sticks well and makes electronic components last longer.
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